NTD4806N, NVD4806N
Power MOSFET
30 V, 76 A, Single N ? Channel, DPAK/IPAK
Features
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? Optimized Gate Charge to Minimize Switching Losses
? AEC ? Q101 Qualified and PPAP Capable ? NVD4806N
? These Devices are Pb ? Free and are RoHS Compliant
Applications
? CPU Power Delivery
? DC ? DC Converters
? Low Side Switching
V (BR)DSS
30 V
http://onsemi.com
R DS(on) MAX
6.0 m W @ 10 V
9.4 m W @ 4.5 V
D
I D MAX
76 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Parameter Symbol
Drain ? to ? Source Voltage
V DSS
Value
30
Unit
V
G
N ? Channel
Gate ? to ? Source Voltage
V GS
" 20
V
S
1 2
3
2 3
Continuous Drain
Current (R q JA ) (Note 1)
Power Dissipation
(R q JA ) (Note 1)
Continuous Drain
Current (R q JA ) (Note 2)
Power Dissipation
(R q JA ) (Note 2)
Continuous Drain
Current (R q JC )
(Note 1)
Power Dissipation
(R q JC ) (Note 1)
Steady
State
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T C = 25 ° C
T C = 85 ° C
T C = 25 ° C
I D
P D
I D
P D
I D
P D
15.6
12
2.65
11.3
8.8
1.4
79
61
68
A
W
A
W
A
W
4
4
1
CASE 369AA CASE 369AD
DPAK IPAK
(Bent Lead) (Straight Lead)
STYLE 2
MARKING DIAGRAMS
& PIN ASSIGNMENTS
Pulsed Drain Current    t p =10 m s
Current Limited by Package
T A = 25 ° C
T A = 25 ° C
I DM
I DmaxPkg
150
45
A
A
4
Drain
4
Drain
Operating Junction and Storage Temperature
Source Current (Body Diode)
T J , T stg
I S
? 55 to
175
50
° C
A
Drain to Source dV/dt
Single Pulse Drain ? to ? Source Avalanche
Energy (V DD = 24 V, V GS = 10 V,
L = 1.0 mH, I L(pk) = 21 A, R G = 25 W )
dV/dt
E AS
6.0
220
V/ns
mJ
2
1 Drain 3
Gate Source
1 2 3
Gate Drain Source
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
T L
260
° C
Y
WW
= Year
= Work Week
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
4806N = Device Code
G = Pb ? Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
? Semiconductor Components Industries, LLC, 2011
October, 2011 ? Rev. 9
1
Publication Order Number:
NTD4806N/D
相关PDF资料
NTD4808N-1G MOSFET N-CH 30V 9.8A IPAK
NTD4809NHT4G MOSFET N-CH 30V 9A DPAK
NTD4809NT4G MOSFET N-CH 30V 9.6A DPAK
NTD4810NHT4G MOSFET N-CH 30V 8.6A DPAK
NTD4810NT4G MOSFET N-CHAN 10.8A 30V DPAK
NTD4813N-35G MOSFET N-CH 30V 7.6A IPAK
NTD4813NHT4G MOSFET N-CH 30V 40A DPAK
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相关代理商/技术参数
NTD4808N 制造商:ONSEMI 制造商全称:ON Semiconductor 功能描述:Power MOSFET 30 V, 63 A, Single N--Channel, DPAK/IPAK
NTD4808N-1G 功能描述:MOSFET NFET 30V 63A 8MOHM RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
NTD4808N-35G 功能描述:MOSFET NFET 30V 63A 8MOHM RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
NTD4808NT4G 功能描述:MOSFET NFET 30V 63A 8MOHM RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
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NTD4809N-35G 功能描述:MOSFET NFET 30V 58A 9MOHM RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
NTD4809N-35H 制造商:Rochester Electronics LLC 功能描述: 制造商:ON Semiconductor 功能描述: